The key to an integrated probe lies not in whether it can be made, but in coaxial alignment, consistency of spring force, and stability of lifespan—precisely the focus of our design and validation.
Features
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Integrated structural design with high coaxiality and stable contact
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Outer diameter Ø 0.15 mm, supporting ultra‑fine pitch designs
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Low contact resistance with high measurement repeatability
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Excellent spring force consistency, preventing IC pad damage
Integrated POGO Pin Probe (Ø 0.15 mm)
High-Density, Ultra-Fine IC Testing Solution
Positioning
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Designed specifically for ultra‑fine pitch and high pin‑count IC testing applications
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Suitable for high‑density socket layouts of 0.2 mm or below
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For wafer‑level inspection prior to packaging
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Stable low contact resistance, ideal for precision measurements
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Compatible with automated mass production and long‑duration testing
Simulation vs. measured consistency (Ø 0.15 mm)
Specification
0.15mm is suitable for high-frequency/high-speed signals (AI/HPC/RF)
Integrated elastic probe
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Ultra‑fine diameter IC and high‑density testing
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High pin‑count SoC / MCU testing
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Advanced packaging (Fan‑out / SiP)
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MEMS / sensor testing
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High‑density IC sockets and test fixtures
Product Appearance Classification
Application scenarios
One-piece cantilever (Cobra) Pin
≥ 50 µm Suitable for pre-packaging testing of wafers