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BeCe™ heat-dissipation fixture: A Testing Revolution Breaking Through Thermal Barriers
In the era of high-performance computing and AI acceleration, chip thermal management has become a design bottleneck. The BeCe™ heat-dissipation fixture provides you with an unprecedented high-power thermal testing solution, supporting your ambitions to challenge performance limits.

The BeCe™ heat-dissipation fixture integrates dual cooling technologies:

  • Perfect Combination of Air and Liquid Cooling Technologies

  • Outstanding Cooling Performance of Up to 300 Watts

  • Precise Temperature Control Ensures Stability in the Testing Environment

  • Optimized Thermal Flow Path Design Eliminates Hot Spots

The BeCe™ heat-dissipation fixture offers unprecedented testing accuracy:

  • Precise Compression Height Adjustment Feature Adapts to Different Package Thicknesses

  • Revolutionary Automatic Calibration System Ensures Consistency in Testing

  • Intelligent Positioning Mechanism: Reduces operational errors.

  • Real-Time Feedback Control: Maintains optimal testing conditions.

BeCe™ ​heat-dissipation fixture

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Seamless Integration of BeCe™ heat-dissipation fixture with the BeCe™ Ecosystem:

  • Fully Compatible with Existing BeCe™ Test Sockets.

  • Simplified Integration Process: Lowers barriers to implementation.

  • Unified User Interface: Reduces learning costs.

  • Modular Design: Meets diverse testing needs.

BeCe™ heat-dissipation fixture Provides Key Support for Next-Generation High-Performance Chip Testing:

  • Supports High-Power AI Accelerators and GPU Testing.

  • Provides Ideal Thermal Environment for High-Density Computing Chips.

  • Ensures Reliable Operation of 5G/6G Communication Processors Under Extreme Conditions.

  • Simulates Harsh Conditions for Automotive-Grade Chips.

Significant Economic Benefits: In addition to technical advantages, the BeCe™ heat-dissipation fixture brings substantial economic benefits:

  • Compact Design: Saves valuable testing space.

  • Maintenance-Free Features: Reduces operational costs.

  • Lightweight Structure: Enhances operational convenience.

  • High Compatibility: Protects existing investment in testing equipment.

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