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A new standard for extreme reliability testing. In the fiercely competitive semiconductor market, your chips not only require exceptional performance but also unparalleled reliability. The BeCe™ BIS burn-in test socket provides you with a groundbreaking testing solution, ensuring your products operate perfectly even under the most demanding conditions.

Designed for Critical Applications, the BeCe™ BIS Burn-In Test Socket is tailored for the following application scenarios:

  • WLCSP: Wafer-Level Chip Size Package testing.

  • fcBGA: Flip-Chip Ball Grid Array packaging testing.

  • DSP: Digital Signal Processor testing.

  • QFN: Quad Flat No-lead package testing.

  • HTOL: High-Temperature Operating Life testing.

BeCe™ Burn-in Test Socket

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The BeCe™ BIS integrates several industry-leading technical specifications:

  • Ultra-Short Signal Path: < 1.1 mm, significantly reducing transmission loss.

  • Ultra-Fine Pitch: Supports pitches of 0.35 mm and above, accommodating advanced packaging.

  • Precise Contact Force: Each pin < 20-30 g, ensuring testing accuracy while minimizing component damage.

  • Extremely Low Inductance: < 0.6 nH to minimize high-speed signal interference.

  • Wide Temperature Range: -45°C to 135°C, meeting the demands of extreme condition testing.

Innovative Structural Design

The BeCe™ BIS utilizes specially treated high-performance plastics and aluminum alloy structures, combined with BeCe™ Contact Buttons made using unique weaving technology, achieving:

  • Compact Overall Size: Saves testing space.

  • Excellent Mechanical Strength: Ensures long-term testing stability.

  • Outstanding Cost Efficiency: Reduces total cost of ownership for testing.

  • Superior Thermal Performance: Suitable for prolonged high-temperature burn-in testing.

Born for Reliability

In fields such as consumer electronics, automotive electronics, industrial control, and high-performance computing, chip reliability is key to success. The BeCe™ BIS burn-in test socket provides you with:

  • The ability to accurately identify early failure modes.

  • A rigorous tool for validating long-term reliability.

  • Testing efficiency that accelerates time-to-market.

  • Quality assurance that reduces recall risks.

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