Designed for Extreme Performance, the BeCe™ HPS Test Socket features contact buttons made using Proprietary Weaving Technology, optimized for the following testing scenarios:
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High-Density I/O Interfaces: Supports the most complex chip designs.
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Ultra-High Bandwidth: Perfectly supports 112G+ PAM4 signal integrity.
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Ultra-Dense Spacing: Testing for BGA/LGA packages with spacing as low as 0.35mm.
BeCe™ HPS High-Performance Test Socket A groundbreaking testing solution — empowering next-generation chip designs.
In the extreme competition of semiconductor design, your innovations are limited by the capabilities of testing tools. The BeCe™ HPS high-performance test socket breaks this boundary, providing unparalleled testing precision for your cutting-edge designs.
BeCe™ High-performance test socket
Comprehensive Excellence
While competitors excel in only one area, the BeCe™ HPS achieves breakthroughs across the board:
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Mechanical Stability: Patented contact design ensures consistent contact throughout the testing cycle.
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Thermal Management: Optimized heat dissipation pathways ensure precision in high-power chip testing.
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Electrical Performance: Low inductance design minimizes parasitic effects.
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Signal Integrity: Unmatched high-frequency performance ensures high-speed transmission without distortion.
Born for Top Designs
The BeCe™ high-performance test socket is your strategic partner in the design process, particularly suited for:
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Mobile communication processors.
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High-performance computing chips.
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Data center-grade network processors.
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High-frequency analog/digital mixed circuits.
Validate Performance Beyond Imagination
As an industry leader, you need testing solutions that not only meet current demands but also anticipate future challenges. The BeCe™ HPS is not just a testing tool; it is the key to pushing the limits of your designs.
Contact us now to arrange a technical demonstration and experience how to elevate your chip designs to new heights.