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BeCe™ Contact Braided Probe Pins

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The precision art of braiding, the perfect connection for testing. In the nanoscale semiconductor world, the quality of testing determines the speed of innovation. BeCe™ Contact Braided Probe Pins, with revolutionary braiding technology, provide unparalleled testing accuracy and reliability for your cutting-edge chip designs.

Breakthrough Braiding Technology

The unique braiding technology of BeCe™ creates Contact Buttons that achieve multiple breakthroughs in the testing field:

  • Ultra-thin Design: Adapts to the strict spatial constraints of advanced packaging

  • Outstanding High-Frequency Performance: Lossless testing of high-speed signals from 5G/6G to 112G+PAM4

  • Extremely Low Inductance Characteristics: Minimizes parasitic effects, ensuring the integrity of test signals

  • High Bandwidth Capability: Perfectly supports the testing needs of next-generation high-speed designs

The Micro-Wipe technology of BeCe™ Contact Buttons brings a revolutionary testing experience:

  • Perfect Penetration of Oxide Layers: Ensures electrical integrity with every test

  • Non-Damaging Contact: Protects your valuable design samples

  • Consistent Contact Impedance: Provides reliable testing data

  • Multiple Use Lifespan: Significantly reduces overall testing costs

Designed for the next generation of chip designs, as chip design moves towards higher frequencies, lower power consumption, and more complex mixed-signal designs, BeCe™ Contact Buttons offer a key competitive advantage:

  • Perfectly Supports Digital and Analog Mixed-Signal Testing

  • Outstanding High-Speed Signal Integrity Performance

  • Adapts to Full-Process Testing Needs from Laboratory to Mass Production

  • Next-Generation Products Fully Meet Wafer-Level Testing Requirements

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